TML1509BU RLT8723BU 150M蓝牙Wifi二合一模组 RLT模块定制

Product Description

TML1509BU is a small size and low profile of WiFi + BT Combo module with LGA (Land-Grid Array) footprint, board size is 13.2mm*12.0mm with module thickness of 2mm. It can be easily manufactured on SMT process and highly suitable for tablet PC, ultra book, mobile device and consumer products. It provides USB interface for WiFi to connect with host processor and high speed USB interface for BT. It also has a PCM interface for audio data transmission with direct link to external audio codec via BT controller. The WiFi throughput can go up to 150Mbps in theory by using 1x1 802.11n b/g/n MIMO technology and Bluetooth can support BT2.1+EDR/BT3.0 and BT4.0.uses Realtek RTL8723BU, a highly integrated WiFi/BT single chip based on advanced COMS process. RTL8723BU integrates whole WiFi/BT function blocks into a chip, such as USB, MAC, BB, AFE, RFE, PA, EEPROM and LDO/SWR, except fewer passive components remained on PCB. 

Product Features

1.Operate at ISM frequency bands (2.4GHz)2.USB for WiFi and Bluetooth3.IEEE standards support: IEEE 802.11b, IEEE 802.11g, IEEE 802.11n, IEEE 802.11d, IEEE 802.11e,4.Fully Qualified for Bluetooth 2.1+EDR specification including both 2Mbps and 3Mbps modulation mode5.Full–speed Bluetooth operation with Piconet and Scatternet support6.WiFi 1 transmitter and 1 receiver allow data rates supporting up to 150 Mbps downstream and 150 Mbpsupstream PHY rates

Pin Assignment

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联系方式

深圳创凌智联 提供相关技术支持服务  韦'S 0755-83224500（直线）13392166636  QQ:2935573255

深圳市创凌智联科技有限公司成立于2005年，是一家专业的WiFi模块，WiFi U盘板卡、WiFi摄像板卡、WiFi覆盖板卡专业定制供应商，以WiFi产品为核心，为客户提供成套解决方案。总部在深圳宝安前海中熙ECO国际大厦,生产加工基地位于宝安沙井，国际业务分公司位于香港观塘开源道日昇中心。

       科技发展日新月异，万物互联的时代迎面而来；创凌智联紧跟时代步伐，谋篇布局，投身以WIFI联接产品为中心的市场中，并辅助以相关联的芯片服务，以满足客户之最大需求。公司根据所服务的客户属性分为WIFI产品事业部。

      WiFi产品事业部

      专注聚焦在WiFi网卡模块，WiFi摄像板卡、WiFi U盘板卡、WiFi覆盖板卡、以及其它WIFI产品定制；专业的WIFI产品定制研发和标准品设计团队，成熟的生产制造、精准的市场规划，为广大客户提供多样化的WiFi产品，力争成为各种智能硬件WiFi产品最佳的合作供应商。

工厂预览

      SMT设备组合：全自动上板机――全自动印刷机→ 松下高速贴片机（可贴01005  0201…元件）→ 多功能机（YAMAHA）→ 十六温区回流焊等高精密设备组合。